molded choke coil ? pia2313sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 31/01/2018 p1 a b c e d a` marking d/c 1. part no. expression: p i a 2 3 1 3 s p 1 r 5 m n a) series code d) inductance code (a) (b) (c) (d) (e)(f) b) dimension code e) tolerance code c) type code f) internal control code 2. configuration & dimensions: 3. schematic: 4. material list: a a? b c d e g h l 23.50.5 22.70.3 22.00.3 12.60.4 5.00.4 19.00.3 12.5 ref. 19.6 ref. 24.0 ref. note: 1. the above pcb layout is for reference only. 2. solder paste thickness of 0.20mm and above is recommended. 3. marking: top row ? inductance code, bottom row ? yyww l g h recommend pc board pattern unit: mm a) core b) wire c) terminal d) ink
molded choke coil ? pia2313sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 31/01/2018 p2 5. general specification: (a) operating temp. : -40c to +125c (inclusive of coil temp rise) (b) storage temp. : -40c to +125c (on board) (c) humidity range : 85 2% rh (d) heat rated current (irms) will cause the coil temperature rise approximately ? t of 40c (keep 1min) (e) saturation current (isat typ.) will cause l0 to drop approximately 30%. (f) part temp. (ambient + temp. rise) should not exceed 125c under worst case operating conditions. (g) storage condition (component in its packaging) i) temperature: less than 40c ii) humidity : 60% rh 6. electrical characteristics: notes: 1) at all times, the current supplied to the product should not exceed isat max. value. part number inductance lo (uh) @ 0a 20% test frequency, l (hz) heat rating current dc ( a ) irms. saturation current dc (a) isat. dcr (m ? )typ. dcr (m ? )max. typ. max. typ. max. pia2313sp1r5mn 1.50 1.0v/100 k 62 57 52 48 1.0 1.15 PIA2313SP2R0MN 2.00 1.0v/100k 60 54 50 45 1.02 1.20 pia2313sp2r2mn 2.20 1.0v/100k 58 52 48 43 1.05 1.25 pia2313sp3r0mn 3.00 1.0v/100k 51 48 44 39 1.42 1.64 pia2313sp3r3mn 3.30 1.0v/100k 49 47 41 37 1.5 1.75 pia2313sp4r7mn 4.70 1.0v/100k 47 44 38 34 1.9 2.2 pia2313sp6r8mn 6.80 1.0v/100k 40 36 36 32 2.7 3.1 pia2313sp100mn 10.0 1.0v/100k 33 30 28 20 3.8 4.15 pia2313sp220mn 22.0 1.0v/100k 22 18 15 14 9.2 11 pia2313sp230mn 23.0 1.0v/100k 22 18 15 14 9.2 11 pia2313sp330mn 33.0 1.0v/100k 19 16 12 10.5 13.5 15.4 pia2313sp470mn 47.0 1.0v/100k 17 14 12 10 17.3 20.8 pia2313sp680mn 68.0 1.0v/100k 14 12 12 9.0 26.2 29.5 pia2313sp750mn 75.0 1.0v/100k 13 11 10.5 8.5 27.5 31.6 pia2313sp820mn 82.0 1.0v/100k 12 10 9.0 7.7 31 34.2 pia2313sp101mn 100.0 1.0v/100k 11 9.5 9.0 7.5 36 40
molded choke coil ? pia2313sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 31/01/2018 p3 7. characteristics curves: pia2313sp1r5mn PIA2313SP2R0MN pia2313sp2r2mn pia2313sp3r0mn pia2313sp3r3mn pia2313sp4r7mn pia2313sp6r8mn pia2313sp100mn pia2313sp220mn pia2313sp230mn pia2313sp330mn pia2313sp470mn
molded choke coil ? pia2313sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 31/01/2018 p4 pia2313sp680mn pia2313sp750mn pia2313sp820mn pia2313sp101mn
molded choke coil ? pia2313sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 31/01/2018 p5 8. soldering: mildly activated rosin fluxes are preferred. the minimum amount of solder can lead to damage from the stresses caused by the differenc e in coefficients of expansion between solder, chip and substrate. our terminations are suitable for all re-flow soldering systems. if hand soldering cannot be avoided, the preferred technique is t he utilization of hot air. 8-1 solder re-flow: recommended temperature profiles for re-flow soldering in figure 1. 8-2 soldering iron (figure 2): products attachment with soldering iron is discoura ged due to the inherent proc ess control limitations. in the event that a soldering iron must be employed the following precautions are recommended. note : a) preheat circuit and products to 150c. b) 355c tip temperature (max.) c) never contact the ceramic with the iron tip d) 1.0mm tip diameter (max.) e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4~5 secs.
molded choke coil ? pia2313sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 31/01/2018 p6 c d 2.00.5 embossed carrier b a cover tape 9. packaging information: 9-1 reel dimension: 9-2 tape dimension: p 200mm or more direction of tape 400mm or more blank portions chip cavity blank portions a0 t k0 b0 4.0 d w f 9-3 packaging quantity: type a(mm) b(mm) c(mm) d(mm) 13?x44mm 44.4+2/-0 1002 13+0.5/-0.2 330 pia 2313 chip / reel 120 inner box 120 carton 480 series size bo(mm) ao(mm) ko(mm) p(mm) w(mm) f(mm) t(mm) d(mm) pia 2313 25.00.1 23.0 0.1 13.60.1 32.00.1 44.00.3 20.20.1 0.50.05 1.50.1
molded choke coil ? pia2313sp series note: specifications subject to change without notice. please check our website for latest information. proprietary and confidential document of superworld 31/01/2018 p7 9-4 tearing off force: application notice: 1. storage conditions: to maintain the solderabililty of terminal electrodes: a) recommended products should be used within 12 months from the time of delivery. b) the packaging material should be kept where no chlorine or sulfur exists in the air. 2. transportation: a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion and mechanical shock are minimized. the force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions. room temp. ( ) room humidity (%) room atm (hpa) tearing speed mm/min 5~35 45~85 860~1060 300
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